Sunnyvale,
Calif. – Synerchip, a provider of
high-speed digital interface chips, said on Monday that it has landed $10.5
million in its third round of funding, co-led by JAFCO Asia and Pac-Link
Capital.
Previous backers Spirox, Magic Shares, Shinden and Synerchip CEO David
Lee also participated.
Synerchip focuses on Digital Interactive Interface for
Video & Audio (DiiVA), a technology that lets consumer electronics devices
connect to one another in a home network.
The technology allows a single cable
to carry uncompressed video, audio, USB, Ethernet, content protection and
power.
Related Links:
http://www.synerchip.com/news_20100419.html
